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  • Effect of annealing residual stress on mobility of TSV vertical switch

    Wang Fengjuan, Ren Jiashuo, Yin Xiangkun, Yu Ningmei, Yang Yuan, Jing Kai, Li Qian IEICE Electronics Express 21 (10), 20240208-20240208, 2024-05-25

    ...stress generated during the annealing process on the mobility of through-silicon via (TSV) vertical switch are analyzed in detail, by employing finite element software ANSYS and orthogonal experimental design...

    DOI Web Site 30 References

  • Blue diode laser and its applications in manufacturing: A brief review

    PASANG Tim, FUJIO Shumpei, SATO Yuji, TSUKAMOTO Masahiro International Journal of the Society of Materials Engineering for Resources advpub (0), 2024-05-20

    ...Their usage is critical due to the advantages over many other technologies including precision and accuracy, fast and high efficiency, productivity, reproducibility, fl exibility, easy to automate, less...

    DOI Web Site 6 References

  • Milling of TiBbm<sub>2</sub> Particle Reinforced High-Modulus Steel

    Kato Hideharu, Matsumoto Kazuya, Ito Yukio, Sakamoto Shigehiko, Sumiya Hitoshi International Journal of Automation Technology 18 (3), 358-365, 2024-05-05

    ...This material is designed to exhibit higher rigidity and strength than conventional iron-based materials by using TiB<sub>2</sub> particles as the reinforcing phase, and is expected to reduce the weight...

    DOI

  • Study of Force Control for Construction Automation

    Hiramatsu Toshifumi, Saiki Miyuki, Hara Naohiro, Yamada Masaki, Sugiura Hisashi Journal of Robotics and Mechatronics 36 (2), 284-293, 2024-04-20

    ...We designed the structure of the SEA, conducted the control design, and fabricated an actual bench simulating a 0.06 m<sup>3</sup> class excavator to verify its performance....

    DOI Web Site Web Site 19 References

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