Microstructural characterization of 3C-SiC wafer for device application
書誌事項
- タイトル
- Microstructural characterization of 3C-SiC wafer for device application
- 著者
- N.Tarumi, K.Watanabe, T.Kokubo, S.Arai, K.Sasaki, K.Kuroda
- 公開日
- 2007
- 資源種別
- journal article
収録刊行物
-
- Abstracts of Spring Meeting of Japan Institute of Metals
-
Abstracts of Spring Meeting of Japan Institute of Metals 397-, 2007
