Ultra-Fine Grain Development in Copper during Multi-Directional forging at 195K
書誌事項
- タイトル
- Ultra-Fine Grain Development in Copper during Multi-Directional forging at 195K
- 著者
- C. Kobayashi, T. Sakai, A. Belyakov, X. Yang, H. Miura
収録刊行物
-
- Phi1.Mag.Letters 87
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Phi1.Mag.Letters 87 751-766, 2007