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Simulation and experiment of liquid-phase microjoining using cone-shaped compliant bump
Bibliographic Information
- Title
- Simulation and experiment of liquid-phase microjoining using cone-shaped compliant bump
- Author
- L.J.Qiu, N.Watanabe, T.Asano
- Published
- 2009
- Resource Type
- journal article
Journal
-
- Proc. 2009 Asia-Pacific Workshop on Fundamentals and Applications of Advanced Semiconductor Devices
-
Proc. 2009 Asia-Pacific Workshop on Fundamentals and Applications of Advanced Semiconductor Devices 2009
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Details 詳細情報について
-
- CRID
- 1010000782066022032
-
- Article Type
- journal article
-
- Data Source
-
- KAKEN
