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Fabrication of SAW Devices with Small Package Size Using Through Substrate Via Technology
Bibliographic Information
- Title
- Fabrication of SAW Devices with Small Package Size Using Through Substrate Via Technology
- Author
- K.Koh H.Okitsui , K.Hohkawa
- Published
- 2010
- Resource Type
- journal article
Journal
-
- 2009 IEEE International Ultrasonics Symposium Proceedings
-
2009 IEEE International Ultrasonics Symposium Proceedings (CD) 2688-2691, 2010
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Details 詳細情報について
-
- CRID
- 1010000782121163520
-
- Article Type
- journal article
-
- Data Source
-
- KAKEN
