{"@context":{"@vocab":"https://cir.nii.ac.jp/schema/1.0/","rdfs":"http://www.w3.org/2000/01/rdf-schema#","dc":"http://purl.org/dc/elements/1.1/","dcterms":"http://purl.org/dc/terms/","foaf":"http://xmlns.com/foaf/0.1/","prism":"http://prismstandard.org/namespaces/basic/2.0/","cinii":"http://ci.nii.ac.jp/ns/1.0/","datacite":"https://schema.datacite.org/meta/kernel-4/","ndl":"http://ndl.go.jp/dcndl/terms/","jpcoar":"https://github.com/JPCOAR/schema/blob/master/2.0/"},"@id":"https://cir.nii.ac.jp/crid/1010000782145025921.json","@type":"Article","resourceType":"学術雑誌論文(journal article)","dc:title":[{"@language":"ja","@value":"Room Temperature Direct Bonding Using Fluorine Containing Plasma Activation"}],"publication":{"prism:publicationName":[{"@language":"ja","@value":"Journal of The Electrochemical Society"}],"prism:publicationDate":"2011","prism:volume":"vol.158","prism:startingPage":"525","prism:endingPage":"529"},"project":[{"@id":"https://cir.nii.ac.jp/crid/1040000782145025920","@type":"Project","projectIdentifier":[{"@type":"KAKEN","@value":"23246125"},{"@type":"JGN","@value":"JP23246125"},{"@type":"URI","@value":"https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-23246125/"}],"notation":[{"@language":"ja","@value":"大気中常温接合の新手法"},{"@language":"en","@value":"New Method for Room Temperature Bonding at Ambient Gas"}]}],"dataSourceIdentifier":[{"@type":"KAKEN","@value":"PRODUCT-13823313"}]}