著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
,Effects of Interfacial Reaction between Lead-Free Solders and Cu Pad on the Joint Strength of QFP,Journal of the JRICu Vol.41-No.1,,,2002,,,293-298,https://cir.nii.ac.jp/crid/1010282256756839452,