著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
青柳 昌宏,Investigation into the Thermal Effects of Thinning Stacked Dies in Three-Dimensional Integrated Circuits,Proceedings of 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC),,,2015,-,,,https://cir.nii.ac.jp/crid/1010282256772576896,