Thermal Displacement and Strain Fields Measurement of Electronic Package, Stacked-MCP, by Phase-Shifting Moire Interferometry using Wedged Glass Plate
書誌事項
- タイトル
- Thermal Displacement and Strain Fields Measurement of Electronic Package, Stacked-MCP, by Phase-Shifting Moire Interferometry using Wedged Glass Plate
- 著者
- Y.Morita, K.Arakawa, M.Todo
収録刊行物
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- Transactions of the Japan Society of Instrument and Control Engineers 41-8
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Transactions of the Japan Society of Instrument and Control Engineers 41-8 625-629, 2005