著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
,"Thermal Displacement and Strain Fields Measurement of Electronic Package, Stacked-MCP, by Phase-Shifting Moire Interferometry using Wedged Glass Plate",Transactions of the Japan Society of Instrument and Control Engineers 41-8,,,2005,,,625-629,https://cir.nii.ac.jp/crid/1010282256781883280,