A Study of the Reliability of MOSFETs in Two Stacked Thin Chips for 3D System in Package
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- 池田 晃裕
- 九州大学
書誌事項
- タイトル
- A Study of the Reliability of MOSFETs in Two Stacked Thin Chips for 3D System in Package
- 著者
- Akihiro Ikeda, et al.
収録刊行物
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- Proc. IEEE 43rd International Reliability Physics Symposium
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Proc. IEEE 43rd International Reliability Physics Symposium 578-579, 2005
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詳細情報
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- CRID
- 1010282256927621509
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- 資料種別
- journal article
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- データソース種別
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- KAKEN