Chamical Mechanical Polishing of SiC Substrate Using Enhanced Slurry Containing Nanobubbles with Active Gas Generated by Plasma
書誌事項
- タイトル
- Chamical Mechanical Polishing of SiC Substrate Using Enhanced Slurry Containing Nanobubbles with Active Gas Generated by Plasma
- 著者
- Shinya MIZUUCHI, Michio UNEDA, Kazutaka SHIBUYA, Yoshio NAKAMURA, Daizo ICHIKAWA and Ken-ichi ISHIKAWA
収録刊行物
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- Proceedings of International Conference on Planarization/CMP Technology 2017
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Proceedings of International Conference on Planarization/CMP Technology 2017 1 372-376, 2017