著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
,Chamical Mechanical Polishing of SiC Substrate Using Enhanced Slurry Containing Nanobubbles with Active Gas Generated by Plasma,Proceedings of International Conference on Planarization/CMP Technology 2017,,,2017,1,,372-376,https://cir.nii.ac.jp/crid/1010282256942812032,