Analysis of Internal Crack Propagation in Silicon Due to Permeable Laser Irradiation-Study on Processing Mechanism of Stealth Dicing
Bibliographic Information
- Title
- Analysis of Internal Crack Propagation in Silicon Due to Permeable Laser Irradiation-Study on Processing Mechanism of Stealth Dicing
- Author
- E.Ohmura, Y.Kawahito, K.Fukumitsu, J.Okuma, H.Morita
Journal
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- Journal of Material Science and Engineering
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Journal of Material Science and Engineering 5(掲載予定) 2011
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Details 詳細情報について
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- CRID
- 1010282257442452128
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- Article Type
- journal article
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- Data Source
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- KAKEN