Analysis of Internal Crack Propagation in Silicon Due to Permeable Laser Irradiation-Study on Processing Mechanism of Stealth Dicing
書誌事項
- タイトル
- Analysis of Internal Crack Propagation in Silicon Due to Permeable Laser Irradiation-Study on Processing Mechanism of Stealth Dicing
- 著者
- E.Ohmura, Y.Kawahito, K.Fukumitsu, J.Okuma, H.Morita
収録刊行物
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- Journal of Material Science and Engineering
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Journal of Material Science and Engineering 5(掲載予定) 2011