著者名,書名,版表示,出版者名,出版年,シリーズ名,番号,ISBN,ISSN,URL
"Lau, John H. and Lee, S. W Ricky","Microvias : for low cost, high density interconnects",,McGraw-Hill,2001,McGraw-Hill professional engineering,,0071363270,,https://cir.nii.ac.jp/crid/1130000794131789184