著者名,書名,版表示,出版者名,出版年,シリーズ名,番号,ISBN,ISSN,URL
"Lau, John H. and Lee, Shi-Wei Ricky","Chip scale package (CSP) : design, materials, processes, reliability, and applications",,McGraw-Hill,1999,Electronic packaging and interconnection series,,0070383049,,https://cir.nii.ac.jp/crid/1130000794809065600