著者名,書名,版表示,出版者名,出版年,シリーズ名,番号,ISBN,ISSN,URL
"Agonafer, D. and International Mechanical Engineering Congress and Exposition and American Society of Mechanical Engineers. Electrical and Electronic Packaging Division","CAE/CAD and thermal management issues in electronic systems : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas",,American Society of Mechanical Engineers,1997,HTD,,0791818527,,https://cir.nii.ac.jp/crid/1130000794905536896