著者名,書名,版表示,出版者名,出版年,シリーズ名,番号,ISBN,ISSN,URL
"Swaminathan, Madhavan and Han, Ki Jin",Design and modeling for 3D ICs and interposers,,World Scientific,2014,WSPC Series in Advanced Integration and Packaging,,9789814508599,,https://cir.nii.ac.jp/crid/1130000795010525056