著者名,書名,版表示,出版者名,出版年,シリーズ名,番号,ISBN,ISSN,URL
"Liu, S. (Sheng) and Qian, Zhengfang and Yeh, Chao-pin and American Society of Mechanical Engineers. Electrical and Electronic Packaging Division and International Mechanical Engineering Congress and Exposition and ASME Symposium on Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures (1998 : Anaheim, Calif.)","Thermo-mechanical characterization of evolving packaging materials and structures : presented at the 1998 ASME International Mechanical Engineering Congress and Exposition : November 15-20, 1998, Anaheim, California",,American Society of Mechanical Engineers,1998,EEP,,0791815919,,https://cir.nii.ac.jp/crid/1130000795466918784