著者名,書名,版表示,出版者名,出版年,シリーズ名,番号,ISBN,ISSN,URL
"Tummala, Rao R. and Rymaszewski, Eugene J. and Klopfenstein, Alan G.",Subsystem packaging,2nd ed.,Chapman & Hall,1997,Microelectronics packaging handbook,,,,https://cir.nii.ac.jp/crid/1130000795468604800