著者名,書名,版表示,出版者名,出版年,シリーズ名,番号,ISBN,ISSN,URL
"菅沼, 克昭","Wide bandgap power semiconductor packaging : materials, components, and reliability",,"Woodhead Publishing, an imprint of Elsevier",2018,Woodhead Publishing series in electronic and optical materials,,9780081020944,,https://cir.nii.ac.jp/crid/1130000795560549376