著者名,書名,版表示,出版者名,出版年,シリーズ名,番号,ISBN,ISSN,URL
"Chen, W. T. and Engel, Paul C. and Jahsman, W. E. (William E.) and American Society of Mechanical Engineers. Winter Meeting and American Society of Mechanical Engineers. Applied Mechanics Division and American Society of Mechanical Engineers. Electronic Packaging Division","Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991",,ASME,1991,EEP,,0791808963,,https://cir.nii.ac.jp/crid/1130000797458358784