著者名,書名,版表示,出版者名,出版年,シリーズ名,番号,ISBN,ISSN,URL
"Chen, William T. and Read, D. T. and American Society of Mechanical Engineers. Applied Mechanics Division and American Society of Mechanical Engineers. Electrical and Electronic Packaging Division and International Mechanical Engineering Congress and Exposition and Symposium on Application of Fracture Mechanics in Electronic Packaging","Application of fracture mechanics in electronic packaging : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas",,American Society of Mechanical Engineers,1997,EEP,,0791818276,,https://cir.nii.ac.jp/crid/1130282270256572672