著者名,書名,版表示,出版者名,出版年,シリーズ名,番号,ISBN,ISSN,URL
"Madenci, Erdogan and Guven, Ibrahim and Kilic, Bahattin",Fatigue life prediction of solder joints in electronic packages with ANSYS,,Kluwer Academic,2003,The Kluwer international series in engineering and computer science,,1402073305,,https://cir.nii.ac.jp/crid/1130282270807621120