著者名,書名,版表示,出版者名,出版年,シリーズ名,番号,ISBN,ISSN,URL
"International Mechanical Engineering Congress and Exposition and American Society of Mechanical Engineers. Electrical and Electronic Packaging Division and Kowalski, G. J.","Packaging of electronic and photonic devices : presented at the 2000 ASME International Mechanical Engineering Congress and Exposition, November, 5-10, 2000, Orlando, Florida",,American Society of Mechanical Engineers,2000,EEP,,0791819302,,https://cir.nii.ac.jp/crid/1130282270966092032