著者名,書名,版表示,出版者名,出版年,シリーズ名,番号,ISBN,ISSN,URL
"Ling, Hung C. and Niwa, Koichi and Shukla, Vishwa N. and International Symposium on Materials for Optoelectronic and Microelectronic Packaging and International Ceramic Science and Technology Congress",Materials in microelectronic and optoelectronic packaging,,American Ceramic Society,1993,Ceramic transactions,,0944904637,,https://cir.nii.ac.jp/crid/1130282271509938432