著者名,書名,版表示,出版者名,出版年,シリーズ名,番号,ISBN,ISSN,URL
"ASME International Electronics Packaging Conference and Chen, William T. and Engel, Peter A. and American Society of Mechanical Engineers","Structural analysis, materials and processes, design, reliability : Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993",,American Society of Mechanical Engineers,1993,EEP,,0791806863,,https://cir.nii.ac.jp/crid/1130282272208422784