著者名,書名,版表示,出版者名,出版年,シリーズ名,番号,ISBN,ISSN,URL
"Tegehall, P. E. and Dunn, Barrie D. and European Space Agency",Impact of cracking beneath solder pads in printed board laminate on reliability of solder joints to ceramic ball grid array packages,,ESA Publications Division,2003,ESA STM,,9290923628,,https://cir.nii.ac.jp/crid/1130862534238494626