{"@context":{"@vocab":"https://cir.nii.ac.jp/schema/1.0/","rdfs":"http://www.w3.org/2000/01/rdf-schema#","dc":"http://purl.org/dc/elements/1.1/","dcterms":"http://purl.org/dc/terms/","foaf":"http://xmlns.com/foaf/0.1/","prism":"http://prismstandard.org/namespaces/basic/2.0/","cinii":"http://ci.nii.ac.jp/ns/1.0/","datacite":"https://schema.datacite.org/meta/kernel-4/","ndl":"http://ndl.go.jp/dcndl/terms/","jpcoar":"https://github.com/JPCOAR/schema/blob/master/2.0/"},"@id":"https://cir.nii.ac.jp/crid/1360002215875567616.json","@type":"Article","productIdentifier":[{"identifier":{"@type":"DOI","@value":"10.1016/j.compscitech.2014.05.016"}},{"identifier":{"@type":"URI","@value":"https://api.elsevier.com/content/article/PII:S0266353814001638?httpAccept=text/xml"}},{"identifier":{"@type":"URI","@value":"https://api.elsevier.com/content/article/PII:S0266353814001638?httpAccept=text/plain"}}],"resourceType":"学術雑誌論文(journal article)","dc:title":[{"@value":"Effects of chain rigidity/flexibility of polyimides on morphological structures and thermal diffusivity of hBN-filled composites"}],"description":[{"notation":[{"@value":"Abstract   Composite films composed of μm-sized hexagonal boron nitride (hBN) flakes and polyimides (PIs) having (a) rigid ( s BPDA-PPD,  s BPPD) and (b) flexible ( s BPDA-ODA,  s BPOD) molecular structures were fabricated to investigate the effects of PI chain structure on the morphological structures as well as in-plane and out-of-plane thermal diffusivity ( TD  //  and  TD  ⊥ ). SEM and WAXD measurements revealed that the two types of composites differ significantly in the void concentration ( ϕ  v ) and the hBN/PI interfacial affinity. The  s BPPD composites exhibited smaller  ϕ  v  than  s BPOD. However, delamination, which was rarely observed at the hBN/ s BPOD interface, was found at the hBN/ s BPPD interface. These differences are attributed to the structure of PI chains: rigid chains of  s BPPD generate dense interchain and polymer-filler packing owning to their small free volume, but relatively high shrinkage rate during curing results in delamination. The  s BPPD composites exhibited large anisotropy in  TD  //  and  TD  ⊥ , reflecting the in-plane orientation of  s BPPD chains. At higher hBN content, the  s BPOD composites exhibited a smaller  TD  ⊥  increase due to an increase in  ϕ  v . In addition, it was demonstrated that the  TD  ⊥  is effectively increased by enhancing the relaxation of PI chains by removing the constraint from the substrate during thermal curing."}]}],"creator":[{"@id":"https://cir.nii.ac.jp/crid/1380566393999015296","@type":"Researcher","foaf:name":[{"@value":"Mizuka Tanimoto"}]},{"@id":"https://cir.nii.ac.jp/crid/1380002215875567616","@type":"Researcher","foaf:name":[{"@value":"Shinji Ando"}]}],"publication":{"publicationIdentifier":[{"@type":"PISSN","@value":"02663538"}],"prism:publicationName":[{"@value":"Composites Science and Technology"}],"dc:publisher":[{"@value":"Elsevier BV"}],"prism:publicationDate":"2014-07","prism:volume":"99","prism:startingPage":"103","prism:endingPage":"108"},"reviewed":"false","dc:rights":["https://www.elsevier.com/tdm/userlicense/1.0/"],"url":[{"@id":"https://api.elsevier.com/content/article/PII:S0266353814001638?httpAccept=text/xml"},{"@id":"https://api.elsevier.com/content/article/PII:S0266353814001638?httpAccept=text/plain"}],"createdAt":"2014-05-21","modifiedAt":"2019-08-10","project":[{"@id":"https://cir.nii.ac.jp/crid/1040282257220209280","@type":"Project","projectIdentifier":[{"@type":"KAKEN","@value":"25288096"},{"@type":"JGN","@value":"JP25288096"},{"@type":"URI","@value":"https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-25288096/"}],"notation":[{"@language":"ja","@value":"極端条件下における芳香族ポリマーの秩序構造変化の計測と光・電子機能材料への展開"},{"@language":"en","@value":"Observation of Variations in Ordered Structures in Aromatic Polymers Induced by Extreme Conditions and Development of Optical and Electronic Functional Materials"}]}],"relatedProduct":[{"@id":"https://cir.nii.ac.jp/crid/1360011145831029888","@type":"Article","relationType":["references"],"jpcoar:relatedTitle":[{"@value":"Semi-Aromatic Polyimides with Low Dielectric Constant and Low CTE"}]},{"@id":"https://cir.nii.ac.jp/crid/1360292619251727872","@type":"Article","relationType":["references"],"jpcoar:relatedTitle":[{"@value":"Thermal diffusivity of aromatic polyimide thin films by temperature wave analysis"}]},{"@id":"https://cir.nii.ac.jp/crid/1360292619779077760","@type":"Article","relationType":["references"],"jpcoar:relatedTitle":[{"@value":"Polyimides Containing Trans-1,4-cyclohexane Unit. 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