Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
Osamu Nakatsuka and Hideki Kitada and Youngsuk Kim and Yoriko Mizushima and Tomoji Nakamura and Takayuki Ohba and Shigeaki Zaima,Characterization of Local Strain around Through-Silicon Via Interconnects by Using X-ray Microdiffraction,Japanese Journal of Applied Physics,0021-4922,IOP Publishing,2011-05-01,50,5S1,05ED03,https://cir.nii.ac.jp/crid/1360003446856221824,https://doi.org/10.1143/jjap.50.05ed03