著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
Y. Shimooka and M. Inoue and M. Endo and S. Obata and A. Kojima and T. Miyagi and Y. Sugizaki and I. Mori and H. Shibata,Robust hermetic wafer level thin-film encapsulation technology for stacked MEMS / IC package,2008 58th Electronic Components and Technology Conference,,IEEE,2008-05,,,,https://cir.nii.ac.jp/crid/1360013337583294336,https://doi.org/10.1109/ectc.2008.4550071