Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
Yoshihiro Koga and Kazunari Kurita,SOI wafer fabricated with extremely thick deposited BOX layer using a surface activated bonding technique at room temperature,Japanese Journal of Applied Physics,0021-4922,IOP Publishing,2019-11-26,59,SB,SBBB02,https://cir.nii.ac.jp/crid/1360284924859687040,https://doi.org/10.7567/1347-4065/ab516e