{"@context":{"@vocab":"https://cir.nii.ac.jp/schema/1.0/","rdfs":"http://www.w3.org/2000/01/rdf-schema#","dc":"http://purl.org/dc/elements/1.1/","dcterms":"http://purl.org/dc/terms/","foaf":"http://xmlns.com/foaf/0.1/","prism":"http://prismstandard.org/namespaces/basic/2.0/","cinii":"http://ci.nii.ac.jp/ns/1.0/","datacite":"https://schema.datacite.org/meta/kernel-4/","ndl":"http://ndl.go.jp/dcndl/terms/","jpcoar":"https://github.com/JPCOAR/schema/blob/master/2.0/"},"@id":"https://cir.nii.ac.jp/crid/1360292618907588864.json","@type":"Article","productIdentifier":[{"identifier":{"@type":"DOI","@value":"10.1177/0954008308088397"}},{"identifier":{"@type":"URI","@value":"https://journals.sagepub.com/doi/pdf/10.1177/0954008308088397"}}],"dc:title":[{"@value":"Organo-Soluble Low CTE Polyimides and their Applications to Photosensitive Cover Layer Materials in Flexible Printed Circuit Boards"}],"description":[{"type":"abstract","notation":[{"@value":"<jats:p> A novel cover layer material for flexible printed circuit (FPC) applications was developed in this work. A high molecular weight of polyimide composed of four monomers, pyromellitic dianhydride (PMDA), 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA), 2,2'-bis(trifluoromethyl)benzidine (TFMB) and 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (BisApAf) was prepared by the one-pot polycondensation in N-methyl-2-pyrrolidone (NMP) without precipitation and gelation. The polyimide (PI) was highly soluble in various common organic solvents. Interestingly, the PI film formed by simple solution-casting of the PI solution had a low CTE value close to that of copper foil, therefore almost no curling of the PI/copper laminate was observed when the PI film was directly formed on a copper foil. The PI film also exhibited other combined properties, including a low CTE, a high T<jats:sub>g</jats:sub>, high thermal stability, low water absorption, comparatively good transparency, the highest levels of non-flammability, good insulation properties and sufficient film flexibility. In addition, fine positive-tone patterns could be obtained from DNQ-containing PI with a sensitivity of 238 mJ cm<jats:sup>-2</jats:sup>. The results revealed that the present PI system is a promising candidate as a novel cover layer material. </jats:p>"}]}],"creator":[{"@id":"https://cir.nii.ac.jp/crid/1380292618907588992","@type":"Researcher","foaf:name":[{"@value":"Junichi Ishii"}],"jpcoar:affiliationName":[{"@value":"Sony Chemical & Information Device Corporation, 1078 Kamiishikawa, Kanuma, Tochigi, 22-8503, Japan,"}]},{"@id":"https://cir.nii.ac.jp/crid/1380292618907588993","@type":"Researcher","foaf:name":[{"@value":"Tadashi Akamatsu"}],"jpcoar:affiliationName":[{"@value":"Sony Chemical & Information Device Corporation, 1078 Kamiishikawa, Kanuma, Tochigi, 22-8503, Japan"}]}],"publication":{"publicationIdentifier":[{"@type":"PISSN","@value":"09540083"},{"@type":"EISSN","@value":"13616412"}],"prism:publicationName":[{"@value":"High Performance Polymers"}],"dc:publisher":[{"@value":"SAGE Publications"}],"prism:publicationDate":"2009-04","prism:volume":"21","prism:number":"2","prism:startingPage":"123","prism:endingPage":"138"},"reviewed":"false","dc:rights":["https://journals.sagepub.com/page/policies/text-and-data-mining-license"],"url":[{"@id":"https://journals.sagepub.com/doi/pdf/10.1177/0954008308088397"}],"createdAt":"2009-03-10","modifiedAt":"2025-03-03","relatedProduct":[{"@id":"https://cir.nii.ac.jp/crid/1390282679300393984","@type":"Article","relationType":["isReferencedBy"],"jpcoar:relatedTitle":[{"@language":"en","@value":"Ultra-low-modulus Positive-type Photosensitive Polyimides (4). Improvement of Adhesion Strength with Copper Foil"}]}],"dataSourceIdentifier":[{"@type":"CROSSREF","@value":"10.1177/0954008308088397"},{"@type":"CROSSREF","@value":"10.2494/photopolymer.22.417_references_DOI_Uk8Z4IFGK3Xnqx52n72PDZVAFbj"}]}