著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
John H. Lau,Recent Advances and Trends in Advanced Packaging,"IEEE Transactions on Components, Packaging and Manufacturing Technology",2156-3950,Institute of Electrical and Electronics Engineers (IEEE),2022-02,12,2,228-252,https://cir.nii.ac.jp/crid/1360298341436388864,https://doi.org/10.1109/tcpmt.2022.3144461