著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
Norio Chujo and Koji Sakui and Shinji Sugatani and Hiroyuki Ryoson and Tomoji Nakamura and Takayuki Ohba,Bumpless Build Cube (BBCube) 3D: Heterogeneous 3D Integration Using WoW and CoW to Provide TB/s Bandwidth with Lowest Bit Access Energy,2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),,IEEE,2023-06-11,,,,https://cir.nii.ac.jp/crid/1360298760949492096,https://doi.org/10.23919/vlsitechnologyandcir57934.2023.10185277