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Effects of Curing Agents on the Adhesion of Epoxy Resin to Copper: A Density Functional Theory Study
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- Yuki Kawashima
- Interdisciplinary Graduate School of Engineering Sciences, Kyushu University, Kasuga, Fukuoka 816-8580, Japan
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- Yuta Tsuji
- Interdisciplinary Graduate School of Engineering Sciences, Kyushu University, Kasuga, Fukuoka 816-8580, Japan
Bibliographic Information
- Published
- 2024-06-06
- Resource Type
- journal article
- Rights Information
-
- https://doi.org/10.15223/policy-029
- https://doi.org/10.15223/policy-037
- https://doi.org/10.15223/policy-045
- DOI
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- 10.1021/acs.langmuir.4c01093
- Publisher
- American Chemical Society (ACS)
Search this article
Journal
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- Langmuir
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Langmuir 40 (24), 12622-12631, 2024-06-06
American Chemical Society (ACS)
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Details 詳細情報について
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- CRID
- 1360306905621045504
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- ISSN
- 15205827
- 07437463
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- Article Type
- journal article
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- Data Source
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- Crossref
- KAKEN
- OpenAIRE
