著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
Eric Beyne and Soon-Wook Kim and Lan Peng and Nancy Heylen and Joke De Messemaeker and Oguzhan Orkut Okudur and Alain Phommahaxay and Tae-Gon Kim and Michele Stucchi and Dimitrios Velenis and Andy Miller and Gerald Beyer,"Scalable, sub 2μm pitch, Cu/SiCN to Cu/SiCN hybrid wafer-to-wafer bonding technology",2017 IEEE International Electron Devices Meeting (IEDM),,IEEE,2017-12,,,32.4.1-32.4.4,https://cir.nii.ac.jp/crid/1360579815763458176,https://doi.org/10.1109/iedm.2017.8268486