著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
Zihao Mo and Fangcheng Wang and Jinhui Li and Qiang Liu and Guoping Zhang and Weimin Li and Chunlei Yang and Rong Sun,Temporary Bonding and Debonding in Advanced Packaging: Recent Progress and Applications,Electronics,2079-9292,MDPI AG,2023-03-31,12,7,1666,https://cir.nii.ac.jp/crid/1360582948520457344,https://doi.org/10.3390/electronics12071666