著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
Takashi Koida and Yuko Ueno,Thermal and Damp Heat Stability of High‐Mobility In<sub>2</sub>O<sub>3</sub>‐Based Transparent Conducting Films Fabricated at Low Process Temperatures,physica status solidi (a),1862-6300,Wiley,2021-01-15,218,4,2000487,https://cir.nii.ac.jp/crid/1360853567672973696,https://doi.org/10.1002/pssa.202000487