著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
L. Cadix and C. Bermond and C. Fuchs and A. Farcy and P. Leduc and L. DiCioccio and M. Assous and M. Rousseau and F. Lorut and L.L. Chapelon and B. Flechet and N. Sillon and P. Ancey,RF characterization and modelling of high density Through Silicon Vias for 3D chip stacking,Microelectronic Engineering,0167-9317,Elsevier BV,2010-03,87,3,491-495,https://cir.nii.ac.jp/crid/1360855568857302912,https://doi.org/10.1016/j.mee.2009.08.026