著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
Flynn P. Carson and Young Cheol Kim and In Sang Yoon,3-D Stacked Package Technology and Trends,Proceedings of the IEEE,0018-9219,Institute of Electrical and Electronics Engineers (IEEE),2009-01,97,1,31-42,https://cir.nii.ac.jp/crid/1360855569001640704,https://doi.org/10.1109/jproc.2008.2007460