著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
S. Lhostis and A. Farcy and E. Deloffre and F. Lorut and S. Mermoz and Y. Henrion and L. Berthier and F. Bailly and D. Scevola and F. Guyader and F. Gigon and C. Besset and S. Pellissier and L. Gay and N. Hotellier and A. -L. Le Berrigo and S. Moreau and V. Balan and F. Fournel and A. Jouve and S. Cheramy and M. Arnoux and B. Rebhan and G. A. Maier and L. Chitu,Reliable 300 mm Wafer Level Hybrid Bonding for 3D Stacked CMOS Image Sensors,2016 IEEE 66th Electronic Components and Technology Conference (ECTC),,IEEE,2016-05,2016,,869-876,https://cir.nii.ac.jp/crid/1360855569920834816,https://doi.org/10.1109/ectc.2016.202