著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
Takayuki Ohba and Koji Sakui and Shinji Sugatani and Hiroyuki Ryoson and Norio Chujo,Review of Bumpless Build Cube (BBCube) Using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Tera-Scale Three-Dimensional Integration (3DI),Electronics,2079-9292,MDPI AG,2022-01-12,11,2,236,https://cir.nii.ac.jp/crid/1360861295379555840,https://doi.org/10.3390/electronics11020236