著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
Y. Liu and J. Wang and L. Yin and P. Kondos and C. Parks and P. Borgesen and D.W. Henderson and S. Bliznakov and E.J. Cotts and N. Dimitrov,Improving copper electrodeposition in the microelectronics industry,2008 58th Electronic Components and Technology Conference,,IEEE,2008-05,,,2105-2110,https://cir.nii.ac.jp/crid/1360863728191635712,https://doi.org/10.1109/ectc.2008.4550276