著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
Y. S. Kim and S. Kodama and Y. Mizushima and N. Maeda and H. Kitada and K. Fujimoto and T. Nakamura and D. Suzuki and A. Kawai and K. Arai and T. Ohba,Ultra thinning down to 4-µm using 300-mm wafer proven by 40-nm node 2Gb DRAM for 3D multi-stack WOW applications,2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers,,IEEE,2014-06,,,,https://cir.nii.ac.jp/crid/1361137045694410624,https://doi.org/10.1109/vlsit.2014.6894347