著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
C. T. Yeh and C. Y. Wu and C. F. Lin and K. M. Chen and M. J. Lin and Y. C. Lin and C. L. Kuo,Cu pattern density impacts on 2.5D TSI warpage using experimental and FEM analysis,2014 IEEE 64th Electronic Components and Technology Conference (ECTC),,IEEE,2014-05,,,297,https://cir.nii.ac.jp/crid/1361137046239709952,https://doi.org/10.1109/ectc.2014.6897302