著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
Aibin Yu and John H. Lau and Soon Wee Ho and Aditya Kumar and Hnin Wai Yin and Jong Ming Ching and Vaidyanathan Kripesh and Damaruganath Pinjala and Scott Chen and Chien-Feng Chan and Chun-Chieh Chao and Chi-Hsin Chiu and Chih-Ming Huang and Carl Chen,Three dimensional interconnects with high aspect ratio TSVs and fine pitch solder microbumps,2009 59th Electronic Components and Technology Conference,,IEEE,2009-05,,,350-354,https://cir.nii.ac.jp/crid/1361418520108993792,https://doi.org/10.1109/ectc.2009.5074039