{"@context":{"@vocab":"https://cir.nii.ac.jp/schema/1.0/","rdfs":"http://www.w3.org/2000/01/rdf-schema#","dc":"http://purl.org/dc/elements/1.1/","dcterms":"http://purl.org/dc/terms/","foaf":"http://xmlns.com/foaf/0.1/","prism":"http://prismstandard.org/namespaces/basic/2.0/","cinii":"http://ci.nii.ac.jp/ns/1.0/","datacite":"https://schema.datacite.org/meta/kernel-4/","ndl":"http://ndl.go.jp/dcndl/terms/","jpcoar":"https://github.com/JPCOAR/schema/blob/master/2.0/"},"@id":"https://cir.nii.ac.jp/crid/1361699994056765952.json","@type":"Article","productIdentifier":[{"identifier":{"@type":"DOI","@value":"10.1149/2162-8777/abdc40"}},{"identifier":{"@type":"URI","@value":"https://iopscience.iop.org/article/10.1149/2162-8777/abdc40"}},{"identifier":{"@type":"URI","@value":"https://iopscience.iop.org/article/10.1149/2162-8777/abdc40/pdf"}}],"dc:title":[{"@value":"Soft Chemical Mechanical Polishing Pad for Oxide CMP Applications"}],"description":[{"type":"abstract","notation":[{"@value":"<jats:p>Chemical mechanical polishing (CMP) is widely accepted as the best planarization technique for fabricating nanoscale devices. A soft CMP pad that can enable higher oxide removal rates (RRs) and good planarity has been proposed for oxide CMP applications. In this study, three pads namely, Pad-1 (hard), Pad-2 (soft), and a commercial pad (hard) were used to polish blanket oxide, and STI patterned wafers. The Pad-2 demonstrated significantly higher RRs and better planarization than the hard pads. Post-polish pad texture analysis on Pad-2 showed a uniform surface asperity distribution. This is due to the novel method of pad manufacturing, which enables precise material placement and consistent pore construction.</jats:p>"}]}],"creator":[{"@id":"https://cir.nii.ac.jp/crid/1381699994056765952","@type":"Researcher","foaf:name":[{"@value":"N. B. Kenchappa"}]},{"@id":"https://cir.nii.ac.jp/crid/1381699994056765957","@type":"Researcher","foaf:name":[{"@value":"Ramtej Popuri"}]},{"@id":"https://cir.nii.ac.jp/crid/1381699994056765954","@type":"Researcher","foaf:name":[{"@value":"Ashwin Chockkalingam"}]},{"@id":"https://cir.nii.ac.jp/crid/1381699994056765958","@type":"Researcher","foaf:name":[{"@value":"Puneet Jawali"}]},{"@id":"https://cir.nii.ac.jp/crid/1381699994056765956","@type":"Researcher","foaf:name":[{"@value":"Shiyan Jayanath"}]},{"@id":"https://cir.nii.ac.jp/crid/1381699994056765955","@type":"Researcher","foaf:name":[{"@value":"Daniel Redfield"}]},{"@id":"https://cir.nii.ac.jp/crid/1381699994056765953","@type":"Researcher","foaf:name":[{"@value":"Rajeev Bajaj"}]}],"publication":{"publicationIdentifier":[{"@type":"PISSN","@value":"21628769"},{"@type":"EISSN","@value":"21628777"}],"prism:publicationName":[{"@value":"ECS Journal of Solid State Science and Technology"}],"dc:publisher":[{"@value":"The Electrochemical Society"}],"prism:publicationDate":"2021-01-01","prism:volume":"10","prism:number":"1","prism:startingPage":"014008"},"reviewed":"false","dc:rights":["http://creativecommons.org/licenses/by-nc-nd/4.0/","https://iopscience.iop.org/info/page/text-and-data-mining"],"url":[{"@id":"https://iopscience.iop.org/article/10.1149/2162-8777/abdc40"},{"@id":"https://iopscience.iop.org/article/10.1149/2162-8777/abdc40/pdf"}],"createdAt":"2021-01-16","modifiedAt":"2021-12-20","relatedProduct":[{"@id":"https://cir.nii.ac.jp/crid/1390852901094972160","@type":"Article","relationType":["isReferencedBy"],"jpcoar:relatedTitle":[{"@language":"en","@value":"Flexible Fiber Conditioner for Fine Conditioning of Polishing Pad and its Evaluation in Chemical Mechanical Polishing: Verification of SUS-FFC on Soft Urethane Foam Pad and Proposal of PEEK-FFC"}]}],"dataSourceIdentifier":[{"@type":"CROSSREF","@value":"10.1149/2162-8777/abdc40"},{"@type":"CROSSREF","@value":"10.20965/ijat.2021.p0878_references_DOI_SjihvK7FpJZkf5KSPzy3x4kfuQ5"}]}