著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
C.Y Yin and M.O Alam and Y.C Chan and C Bailey and Hua Lu,The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications,Microelectronics Reliability,0026-2714,Elsevier BV,2003-04,43,4,625-633,https://cir.nii.ac.jp/crid/1362262943942470656,https://doi.org/10.1016/s0026-2714(02)00348-7